Submissions

Full Paper Submission

All authors have been informed about the acceptance of their abstracts. The camera-ready full papers were originally to be submitted by August 25. The deadline is now extended until September 3, 2021.

Please note that we are using the standard IEEE paper template this year, it can be downloaded below both in docx- and in Latex-format. Before you upload the final version, the PDF file must pass the IEEE PDF eXpress checker, otherwise the upload in ConfTool will not be possible. For the IEEE PDF eXpress checker you need the conference ID, which is as follows: 52472X.

The papers will be distributed in time for the conference.

Downloads

Word – Template:

Download here (.docx/30 KB)

Latex – Template :

Download here (.zip/759 KB)

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

Key dates in the submission process

Deadline abstract submission
May 17, 2021

Notification for acceptance
Delayed until July 6, 2021

Extended deadline for full paper submission
September 3, 2021

Paper upload will be possible starting July 14. You will need to submit you full paper in pdf format. Please make sure to use the IEEE paper template provided on this page and to go through the IEEE Xpress pdf checker, before uploading your camera-ready paper through the conference system.
While you are uploading the paper, you will also be asked to identify the presenting author and to provide a short bio of him or her.
 

    Contact

    In case you experience any problems with the submission process, please contact us at therminic@mcc-events.de 

    Pre-recorded Presentations

    Due to the uncertainties surrounding the Delta variant in the COVID-19 development, THERMINIC 2021 Workshop will again be an on-demand virtual event of pre-recorded presentations combined with a live event on September 23, 2021.

    Pre-recorded 10-12-minute video presentations (oral presenters)
    If your abstract has been accepted for oral video presentation, we kindly ask you to submit a 10-12-minute audio/video presentation of your work. Whether you appear personally in the video, or whether the video contains only the slides accompanied by audio will be your choice.
    These video presentations will be available to all conference participants 10 days before and two weeks after the conference.

    Additional pre-recorded 3-minute-video presentation
    In addition to the full video presentation we ask you to upload a 3-minute-pitch of your presentation with a maximum of 3 slides, including an intro slide with the title and co-authors of your contribution. This video will be shown on the day of the live event on September 23 similar to the poster pitches we usually have at THERMINIC Workshops.

    Upload of the pre-recorded video presentation will be possible starting on September 1.

    How to record your video presentation

    Recording a presentation can be tricky if you’re a newcomer in this field. To make it a little easier for you we have compiled a PowerPoint Recording Guide with useful hints on how to record your presentation on Microsoft PowerPoint. Please note that, depending on your license, the video recording option might be disabled in the PowerPoint recording tool.

    It‘s up to you if you want to show yourself on camera while presenting or if you only want to record your voice. We advise you to make a test recording before you record your actual presentation to ensure that the sound and picture quality is good.

    As long as the quality of your recording is good, you can also use many other programs. Popular recording tools include

    If you have used any of these before and were happy with the result, please feel free to use them to record your Therminic 2020 presentation!

    At the end you will need a video file in one of the following formats: .mp4/ .mpg/ .avi/.mov/ .wmv that you can upload to our event platform.

    Topics

    Thermal management of electronic components and systems

    • Classical and modern thermometry and thermography
    • Thermal interface materials and their characterisation
    • Thermal modelling and investigation of packages
    • Nano-scale heat transfer
    • Multi-physics simulation and field coupling
    • Electro-thermal modelling and simulation
    • CFD modelling and benchmarking
    • Advanced thermal materials and technologies
    • Numerical methods for multi-scale heat transfer

      Electronics Cooling Concepts and Applications

      • Cooling concepts: air, liquid, 2-phase, etc.
      • Power electronics
      • High temperature electronics
      • Solid state lighting / LEDs
      • Thermo-electric and sub-ambient cooling
      • Novel and advanced cooling technologies
      • Heat pipe and vapour chambers
      • 3D heterogenous integration and cooling
      • Ultra low form factor air cooling
      • Novel manufacturing methods
      • Cooling for IoT, CPS, mobile, edge computing
      • Thermal buffering for computational sprinting
      • Battery thermal management

      Thermo-mechanical reliability

      • Prognostics and health monitoring
      • Lifetime modelling and prediction
      • Damage and fracture mechanics
      • Failure analysis and inline inspection by thermal imaging