27TH INTERNATIONAL WORKSHOP

THERMAL INVESTIGATIONS OF ICS AND SYSTEMS

SEPTEMBER 22 – 24, 2021

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems.

Welcome to

THERMINIC 2021

back live on stage

The 27th THERMINIC Workshop will be held in Berlin, the capital of Germany. At present, we envisage a physical event again and would go back to virtual only as a backup scenario.

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special occasion with a high quality technical programme and exciting social events. This time, we will again offer professional development courses (PDCs) on the day before the workshop.

Therminic Newsletter

Don´t miss important dates, deadlines and announcements with the Therminic Newsletter 

Call for Papers

(.pdf/ 600KB)

 

We invite delegates to consider submitting abstracts that are related to, but not limited to, the following topics.

Thermal Phenomena in Simulation & Experiment

  • Thermal management of electronic component & systems
  • Classical and modern thermometry and thermography
  • Thermal interface materials & their characterisation
  • Thermal modelling and investigation of packages
  • Nano-scale heat transfer
  • Multi-physics simulation and field coupling
  • Electro-thermal modelling and simulation
  • CFD modelling and benchmarking
  • Advanced thermal materials and technologies
  • Numerical methods for multi-scale heat transfer

Electronics Cooling Concepts & Applications

  • Cooling concepts: air, liquid, 2-phase, etc.
  • Power electronics
  • High temperature electronics
  • Solid state lighting / LEDs
  • Thermo-electric & sub-ambient cooling
  • Novel and advanced cooling technologies
  • Heat pipe & vapour chambers
  • 3D heterogeneous integration & cooling
  • Ultra low form factor air cooling
  • Novel manufacturing methods
  • Cooling for IoT, CPS, mobile, edge computing
  • Thermal buffering for computational sprinting
  • Battery thermal management

Thermo-Mechanical Reliability 

  • Thermo-mechanical reliability
  • Prognostics and health monitoring
  • Lifetime modelling and prediction
  • Damage and fracture mechanics
  • Failure analysis & inline inspection by thermal imaging

Venue

The THERMINIC 2021 will held at the Fraunhofer Forum, Berlin.

Anna-Louisa-Karsch-Str. 2
10178 Berlin, Germany
www.forum.fraunhofer.de

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