27TH INTERNATIONAL WORKSHOP

THERMAL INVESTIGATIONS OF ICS AND SYSTEMS

ONLINE LIVE DAY – SEPTEMBER 23, 2021

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems.

Welcome to

THERMINIC 2021

THERMINIC 2021 goes online – Sept. 13 – Oct. 8, 2021

We would have loved to meet you in person in Berlin for the 27th THERMINIC Workshop, but the current situation with almost daily changing travel regulation due to the delta variant of the Coronavirus make reliable planning for an onsite event impossible.

Therefore, after careful consideration, we have once more opted for a one-day online Therminic (on September 23), with one keynote, then live oral presentations and prerecorded sessions. The majority of contributions will be available 10 days before and two weeks after the conference as pre-recorded video presentations.

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special occasion with a high quality technical programme and exciting social events. This time, we will again offer professional development courses (PDCs) on the day before the workshop.

Therminic Newsletter

Don´t miss important dates, deadlines and announcements with the Therminic Newsletter 

Thermal Phenomena in Simulation & Experiment

  • Thermal management of electronic component & systems
  • Classical and modern thermometry and thermography
  • Thermal interface materials & their characterisation
  • Thermal modelling and investigation of packages
  • Nano-scale heat transfer
  • Multi-physics simulation and field coupling
  • Electro-thermal modelling and simulation
  • CFD modelling and benchmarking
  • Advanced thermal materials and technologies
  • Numerical methods for multi-scale heat transfer

Electronics Cooling Concepts & Applications

  • Cooling concepts: air, liquid, 2-phase, etc.
  • Power electronics
  • High temperature electronics
  • Solid state lighting / LEDs
  • Thermo-electric & sub-ambient cooling
  • Novel and advanced cooling technologies
  • Heat pipe & vapour chambers
  • 3D heterogeneous integration & cooling
  • Ultra low form factor air cooling
  • Novel manufacturing methods
  • Cooling for IoT, CPS, mobile, edge computing
  • Thermal buffering for computational sprinting
  • Battery thermal management

Thermo-Mechanical Reliability 

  • Thermo-mechanical reliability
  • Prognostics and health monitoring
  • Lifetime modelling and prediction
  • Damage and fracture mechanics
  • Failure analysis & inline inspection by thermal imaging

Submissions

All authors have been informed about the acceptance of their abstracts and are now required to submit a full paper to Therminic 2021.

The recommended length is six pages, minimum length is four pages. The papers will be made available after the conference through the IEEE Xplore data base.

Sponsoring

More than 100 participants from over 25 countries are expected at THERMINIC 2021, making the conference the ideal platform to provide your company with an exceptional level of international exposure for your products and services and to significantly enhance your standing and reputation with regard to thermal investigations!

Technical Sponsors

Supporters